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| Micro-Probing & Laser Trimming |
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Decapsulation and Examination.Decapsulation of a device to expose the Die is often the next step in the process. The surface of a die is prepared for further examination using a precision polishing station. Layers of a chip are removed using a Planar Plasma Etcher. Imaging is required to help understand the construction of any device. Optical microscopes can produce useful images. |
Sometimes Scanning Electron Microscopy (SEM) is required offering magnification up to 300,000 times. Cross sectional images can reveal further information about the construction of a device. Next step, Micro-Probing and Laser Trimming >> |