Decapsulation and Examination
Decapsulation of a device to expose the Die is often the next step in the process.
Decapsulation is often the next step in the process. Various chemical and mechanical techniques are combined to expose the target device. The surface of the die is prepared for further examination and then each layer is prepared for imaging using our Gatan precision polishing station.
Imaging is required to help understand the construction of any device. Optical microscopes can produce useful images.
Sometimes Scanning Electron Microscopy (SEM) is required offering magnification up to 300,000 times. Cross sectional images can reveal further information about the construction of a device.