Raw Science - Reverse Engineering Services
Die decapsulation Die decapsulation Die decapsulation

Decapsulation and Examination.

Decapsulation of a device to expose the Die is often the next step in the process.

The surface of a die is prepared for further examination using a precision polishing station. Layers of a chip are removed using a Planar Plasma Etcher.

Imaging is required to help understand the construction of any device. Optical microscopes can produce useful images.

Die decapsulation

Sometimes Scanning Electron Microscopy (SEM) is required offering magnification up to 300,000 times. Cross sectional images can reveal further information about the construction of a device.

Next step, Micro-Probing and Laser Trimming >>

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