X-ray imaging is a powerful tool for our engineers. Our new Dage XD7600 system gives Sub-Micron-Real-Time X-ray images
of semiconductor devices whilst they are in use.
Wire Bonding arrangements and PCB layouts can be quickly and easily analysed.
Multi Die and Hybrid devices are easily identified.X-Ray imaging allows our engineers to decide on the precise methods to use for the next stages of analysis.
